part ? number ? identification p 21 bn 300 m 5 s t product case ? size material capacitance capacitance voltage termination packaging p ? = ? milli \ cap? 21 ? = ? 0201 300 ? = ? 30pf tolerance rating s ? = ? ag ? term, m ? = ? 20% 5 ? = ? 50vdc ni ? barrier, au ? flash rohs nominal 0.006" code bn ceramic ? material ? info resistance insulation 25c ? 15% 3.00% > ? 10 5 ? temperature ? coeff. of ? capacitance ( \ 55c ? to ? 125c) 1mhz ? max dissipation factor max 0.024" dim ? "a" code 21 ? (0201) tolerance ? 0.001" case ? size ? definitions dim ? "b" sonet functional ? applications: benefits: very ? low ? series ? inductance increased ? useable ? bandwidth ultra ? high ? series ? resonance matching ? filter ? applications test ? equipment photonics milli \ cap? milli \ cap?: ?? the ? "ideal" ? smt ? capacitor p21bn300m5s ???????????? low ? loss, ? high ? q t ? = ? tape ? & ? reel
recommended ? attachment ? materials conductive ? epoxy ? (epo ? tek ? ? ? h20e, ? ablebond ? ? ? 84 \ 1 ? lmi, ? etc.) solder ? (sn62, ? sn63, ? etc.) 1. 2. 3. cure ? according ? to ? the ? epoxy ? manufacturer's ? preferred ? schedule ????? typically ? 125c ? to ? 150c ? max. 4. recommended ? micro \ strip ? layout: attachment ? method: description code termination ??? termination ? finish ? and ? recommended ? attachment ? methods after ? curing, ? inspect ? the ? joing ? for ? epoxy ? shorts ? across ? the ? termination ? and ? microstrip ? gaps ? that ? would ? cause ? a ? short ? across ? the ? gap. isopropanol ? and ? methanol ? are ? both ? safe ? to ? use ? to ? pre \ clean ? milli \ caps ? ? ? they ? are ? not ? to ? be ? used ? after ? mounting ? with ? conductive ? epoxy ? as ? they ? act ? as ? a ? solvent. recommended ? attachment ? to ? soft ? or ? hard ? substrate ? using ? conductive ? epoxy: place ? a ? single ? drop ? of ? conductive ? epoxy ? onto ? each ? micro \ strip ? line ? as ? illustrated. ?? the ? edge ? of ? the ? epoxy ? shall ? be ? at ? least ? 0.003" \ 0.004" ? back ? from ? the ? edge ? of ? the ? trace ? to ? prevent ? filling ? the ? gap ? with ? epoxy. centering ? the ? termination ? gap ? of ? the ? capacitor ? within ? the ? gap ? in ? the ? micro \ strip, ? press ? with ? careful, ? even ? pressure ? onto ? the ? micro \ strip ? ensuring ? the ? terminations ? make ? good ? contact ? with ? the ? epoxy ? drops. s ag ? termination, ? minimum ? 50" ? ni ? barrier ? layer, ? 7.5 ? ? 5" ? au ? flash. ?? distance from trace edge: .003? - .004? ideal micro strip width: .012? - .015? gap: .008? - .010? epoxy diameter: .005 - .008? epoxy thickness: .003? - .005?
1. 2. 3. 4. recommended ? micro \ strip ? layout: attachment ? method: isopropanol ? and ? methanol ? are ? both ? safe ? to ? use ? with ? soldered ? milli \ caps ? ? reflow ? according ? to ? the ? solder ? manufacturer's ? preferred ? profile, ? ensuring ? the ? reflow ? temperature ? does ? not ? exceed ? 250c. after ? the ? reflow ? step ? is ? completed, ? inspect ? the ? joint ? for ? voids ? or ? excess ? flux ? and ? non \ reflowed ? solder ? balls ? that ? can ? degrade ? performance ? or ? cause ? shorts ? across ? the ? gaps. ?? proper ? cleaning ? after ? the ? reflow ? process ? is ? crucial ? to ? avoiding ? performance ? degradation ? and ? discovering ? poor ? solder ? joints. recommended ? attachment ? to ? soft ? or ? hard ? substrate ? using ? solder: place ? a ? single ? drop ? of ? solder ? paste ? onto ? each ? micro \ strip ? line ? as ? illustrated. ?? the ? edge ? of ? the ? solder ? paste ? shall ? be ? at ? least ? 0.001" \ 0.002" ? back ? from ? the ? edge ? of ? the ? trace ? to ? prevent ? filling ? the ? gap ? with ? solder. centering ? the ? termination ? gap ? of ? the ? capacitor ? within ? the ? gap ? in ? the ? micro \ strip, ? press ? with ? careful, ? even ? pressure ? onto ? the ? micro \ strip ? ensuring ? the ? terminations ? make ? good ? contact ? with ? the ? drops ? of ? solder ? paste. ??? recommended ? attachment ? methods ? (continued) distance from trace edge: .001? - .002? ideal micro strip width: .012? - .015? gap: .008? - .010? solder diameter: .010 - .015?) solder thickness: .004? - .006?
code blank s customer ? specified ? (drawing ? required, ? tooling ? charges ? may ? apply) ??? packaging packaging description t generic ? waffle ? pack tape ? and ? reel: ? 7" ? reel, ? 100pc ? minimum, ? 5000pc ? maximum (consult ? with ? a ? sales ? representative ? for ? availability)
\ 30 \ 25 \ 20 \ 15 \ 10 \ 5 0 \ 6 \ 5 \ 4 \ 3 \ 2 \ 1 0 0 5 10 15 20 25 30 35 40 45 50 return ? loss ? (s11 ? magnitude ? in ? db) insertion ? loss ? (s21 ? magnitude ? in ? db) frequency ? (ghz) p21bn300m5s insertion ? loss ? (s21) return ? loss ? (s11)
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